Resin dicing blade is suited for cutting hard and brittle materials,such as QFN, sapphire, quartz and glass, etc
* Excellent cutting ability that help reduce chipping, fractures and achive smooth surface finish
* Dicing hard and brittle materials. Such as QFN/MLF, Thick Ceramic Substrates and Glass, etc
* Able to precisely control diamond concentration to achieve cutting quality
* Self sharpening matrix to expose new diamonds. Diamond grit size ranges from 3μm to 250μm depending on blade thickness
Glass (optical devices, fiber optics), quartz (optical splitters, saw devices), LiTa03 LiNb03 (devices), QFN （copper epoxy molding ), splitter, sapphire
Semiconductor Industry Solutions
PCD & PCBN Tools Grinding Industry
Diamond Cutting Bruting Polishing
Add: No.171 Zhongyuan Rd, Zhongyuan District, Zhengzhou, 450001, Henan, China
Tel: +86-371-86545906
Phone / Whats App: +86 18339903057
E-mail: [email protected]
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