Peripheral grinding of silicon ingots, or processing the outer surface of silicon ingots and to make orientation flat
For semiconductors and electronics parts, automobiles and photovoltaic industies
Cylindrical Grinding Silicon Ingots
Features of cylindrical grinding wheel for silicon ingot
- Realizes a total-like cost cut by fast material removal
- Minimal influence on crystalline structure
- Low grinding load, good grinding performance and wear resistance
- Rngot surface with a high flat degree.
- Low dressing frequency
Specifications of 6A2 Diamond Wheel for Cylindrical Grinding Silicon Ingot
| D (mm) | T (mm) | H (mm) | W (mm) | X (mm) | Materials |
| 100 | 28 | 31.75 | 3, 5, 6, 9 | 3-8 | Silicon, sapphire, and gallium arsenide (GaAs) |
| 200 | 35, 50, 60 | 76, 80 | 3, 5, 6, 9 | ||
| 300 | 20, 30, 35 | 127 | 5, 7 | ||
| 350 | 40 | 5, 7 | |||
| Rough / Fine grinding ( 100 - 1000#) | |||||
| Other specifications can be custom according to the requirement | |||||
Semiconductor Industry Solutions
PCD & PCBN Tools Grinding Industry
Diamond Cutting Bruting Polishing
Add: No.171 Zhongyuan Rd, Zhongyuan District, Zhengzhou, 450001, Henan, China
Tel: +86-371-86545906
Phone / Whats App: +86 18339903057
E-mail: [email protected]
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