Diamond grinding wheel for silicon wafers are used to process silicon wafers(including the compound semiconductors) to be thin and flat.
Diamond wheel for back grinding are used to grind the back side of silicon wafer in order to improve the quality of processing and reduce grinding damage. It also makes it possible to shorten the processing time because it lightens the polishing process.
Semiconductor Industry Solutions
PCD & PCBN Tools Grinding Industry
Diamond Cutting Bruting Polishing
Add: No.171 Zhongyuan Rd, Zhongyuan District, Zhengzhou, 450001, Henan, China
Tel: +86-371-86545906
Phone / Whats App: +86 18339903057
E-mail: [email protected]
