More SuperHard Meet You In CIOE 2019

2019.09.06More SuperHard Products Co., Ltd145

CIOE 2019.jpg

China International Optoelectronic Exposition (CIOE) was held in shenzheng international convention and exhibition center from September 4 to 7, 2019.More super Hard were invited to attend the exhibition.

CIOE 2019

Diamond grinding wheels are used for silicon wafer grinding. our advanced technology makes back grinding wheel possible to grind all types of semiconductor wafers with less subsurface damage.

Diamond Back Grinding Wheel

More Superhard diamond / CBN grinding disc including resin diamond / CBN grinding disc, vitrified diamond / CBN grinding disc, double-disc surface grinding disc, pellet grinding wheel and so on.

Double Disc Diamond & CBN Grinding Wheel

More Superhard provides polyurethane (PU) polishing pads. Abrasive fillers include cerium and zirconium, some pads do not have abrasive filler.

Double Disc Diamond & CBN Grinding Wheel

Dicing blades are used for cutting silicon wafers, copper wafer, LED Packages, hard and brittle materials.

Diamond Dicing Blade

More SuperHard Products Co., Ltd is dedicated to finding solutions that help our clients in all markets succeed. More SuperHard has been manufacturing high-quality, competitively priced superabrasive diamond and cbn tools that are designed to perform in a wide range of industrial ,such as PCD Tools Grinding, Natural Diamond Polishing, Auto Parts Processing , Thermal Spray Coated Industry, Optical Glass, Semicon and LED Industry, Woodworking Tool , CNC Tool Grinding and Roll Machining ,others ultral precision industry.

Pre: CIOE 2019 (China International Optoelectronic Exposition)

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More SuperHard Meet You In CIOE 2019

Diamond grinding wheels are used for silicon wafer grinding. our advanced technology makes back grinding wheel possible to grind all types of semiconductor wafers with less subsurface damage.

More Superhard diamond / CBN grinding disc including resin diamond / CBN grinding disc, vitrified diamond / CBN grinding disc, double-disc surface grinding disc, pellet grinding wheel and so on.

More Superhard provides polyurethane (PU) polishing pads. Abrasive fillers include cerium and zirconium, some pads do not have abrasive filler.

Dicing blades are used for cutting silicon wafers, copper wafer, LED Packages, hard and brittle materials.

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