Electroformed hub dicing blade

electroformed hub dicing blade is used for cutting Silicon Wafers, copper wafer, IC/LED Packages, Compound Semiconductor Wafers (GaAs, Gap),Oxide Wafers (LiTaO3), Optical Glass

Alias: Type: hub dicing blade

Application: silicon wafer, copper wafer

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Electroformed hub dicing blade is made by using an ultra-thin diamond wheel and a high precision aluminum alloy hub.

Applications of hub dicing blade:

cutting Silicon Wafers, copper wafer, IC/LED Packages, Compound Semiconductor Wafers (GaAs, Gap),Oxide Wafers (LiTaO3), Optical Glass

The features of hub type dicing blade:

* improving balance between blade life and processing quality (in particular backside chipping)

* Strengthens rigidity, Reduction in wavy cutting and blade wear under high load conditions

* precise control of diamond grit size, diamond concentration, and nickel bond hardness to reduce splitting on the edges

* Realizes high speed wafer cutting after laser grooving.

The specification of hub type dicing blade:

Exposure(μm)	380	510	640	760	890	1020	1150	1270	grit size
Kerf width(μm)	380 - 510	510 - 640	640 - 760	760 - 890	890 - 1020	1020 - 1150	1150 - 1270	1270 - 1400	#5000 #4800 #4500 #4000 #3500 #3000 #2500 #2000 #1800 #1700 #1500
16 - 20	20 * 380	20 * 510
21 - 25	25 * 380	25 * 510	25 * 640
26 - 30	30 * 380	30 * 510	30 * 640	30 * 760	30 * 890	20 * 1020
31 - 35	35 * 380	35 * 510	35 * 640	35 * 760	35 * 890	35 * 1020
36 - 40	40 * 380	40 * 510	40 * 640	40 * 760	40 * 890	40 * 1020	40 * 1150
41 - 50	50 * 380	50 * 510	50 * 640	50 * 760	50 * 890	50 * 1020	50 * 1150	50 * 1270
51 - 60		60 * 510	60 * 640	60 * 760	60 * 890	60 * 1020	60 * 1150	60 * 1270
61 - 70			70 * 640	70 * 760	70 * 890	70 * 1020	70 * 1150	70 * 1270
71 - 80					80 * 890	80 * 1020	80 * 1150	80 * 1270
81 - 90						90 * 1020	90 * 1150	90 * 1270

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Electroformed hub dicing blade

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