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Diamond dicing blades for semiconductor industry

Diamond dicing blade is used for grooving ,cutting silicon, compound semiconductors, glass and other materials in electronic information industry. Diamond dicing blade is one of new products developed .

diamond dicing blade for semiconductor & LED industry


The Type: diamond hub dicing blade and diamond hubless dicing blade

Electroformed diamond hub dicing blade

Electroformed dicing 

blade

Features: 

Easy to handle ultra-thin blade

Blade dicing after laser grooving

Variety of different grit concentrations 

Shows stable processing performance in

 high load processing

 




Hub dicing blade

Application:  Silicon wafers, compound semiconductor wafers (GaAs, Gap),oxide wafers (LiTaO3)

 

resin dicing blade


   resin dicing blade

Features: 

High processing quality for cutting of hard, brittle materiais

Able to precisely control diamond concentration to achieve cutting quality

Improved cut quality on hard materials 

 










Hubless dicing 

blade

Application:

Glass, Crystal, Quart, LiTaO3, Ceramics, Optical, QFN, splitter 

 metal dicing blade

  

   metal dicing balde

Features: 

High rigidityminimized wavy and slant cutting

Able to control diamond concentration to 

achieve cutting quality

Excellent rigidity and cut quality 

Application:  Electronic parts, Optical devices, semiconductor packages, BGA, CSP, 

Electroformed dicing balde

Electroformed dicing 

balde

Features: 

Wide selection of blade options

Proprietary thin-blade technology

Blade thickness - 0.015 mm to 0.3 mm

Available for both dicing saws and slicers

Application:  Various types of semiconductor packages, ceramics, magnetic materials, PCB, silicon 

Other specification can be produced according to customers requirements   

sales@moresuperhard.com       www.moresuperhard.com


In addition to diamond dicing blades for semi-conductor & LED industry, More Superhard Products Co,.Ltd also supplies :

Silicon grinding wheels are used for the thinning and fine grinding of the silicon wafer.

Sapphire Grinding wheel for LED substrate 

Back grinding wheel for grinding the back side of sapphire wafer ;

Edge grinding wheel, roller dresser and other others semi-conductor tools .

semi-conductor tools


For more information about diamond dicing blades, plaese contact us at any time.

sales@moresuperhard.com

www.moresuperhard.com

TEL: 0086-371-86545906 e-mail: sales@moresuperhard.comAre you interested in tool
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