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Diamond Dicing Blades

diamond dicing blades

Diamond dicing blade is used for grooving ,cutting silicon, compound semiconductors, glass and other materials in electronic information industry.

The Type: diamond hub dicing blade and diamond hubless dicing blade

Electroformed diamond hub dicing blade

Electroformed dicing 



Easy to handle ultra-thin blade; Blade dicing

after laser grooving; Variety of different grit 

concentrations; Shows stable processing 

performance in high load processing

Hub dicing blade

Application:  Silicon wafers, compound semiconductor wafers (GaAs, Gap),oxide wafers (LiTaO3)


resin dicing blade

   resin dicing blade


High processing quality for cutting of hard, brittle materiais; Able to precisely control diamond concentration to achieve cutting quality; Improved cut quality on hard materials 


Hubless dicing 



Glass, Crystal, Quart, LiTaO3, Ceramics, Optical, QFN, splitter 

 metal dicing blade


   metal dicing balde


High rigidityminimized wavy and slant cutti

g ; Able to control diamond concentration to 

achieve cutting quality ;Excellent rigidit and 

cut quality

Application:  Electronic parts, Optical devices, semiconductor packages, BGA, CSP, 

Electroformed dicing balde

Electroformed dicing 



Wide selection of blade optionsProprietary 

thin-blade technology ;Blade thickness - 0.0

15 mm to 0.3 mm; Available for both dicing

saws and slicers

Application:  Various types of semiconductor packages, ceramics, magnetic materials, PCB, silicon 

Other specification can be produced according to customers requirements  

TEL: 0086-371-86545906 e-mail: sales@moresuperhard.comAre you interested in tool
Enquire here

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