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International Department

More Super Hard Products Co., Ltd

TEL: 0086-371-86545906

Whatsapp: + 86 13323855288

Email: sales@moresuperhard.com

Add: no.171 zhongyuan rd, zhongyuan district, zhengzhou, henan,450001 china

Optical & Semicon  Industry

Diamond Dicing Blades

Diamond Dicing Blades

Diamond dicing blade is used for grooving ,cutting silicon, compound semiconductors, glass and other materials in electronic information industry.


Type: resin dicing blade, metal dicing blade , ele
Application: Silicon wafers, compound semiconducto
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Diamond dicing blade is used for grooving ,cutting silicon, compound semiconductors, glass and other materials in electronic information industry.

The Type: diamond hub dicing blade and diamond hubless dicing blade

electroformed dicing blade

Electroformed dicing 

blade

Features: Easy to handle ultra-thin blade; Blade dicing after laser grooving; Variety of different grit

concentrations; Shows stable processing performance in high load processing

 

 

 

Hub dicing blade

Application:  Silicon wafers, compound semiconductor wafers (GaAs, Gap),oxide wafers (LiTaO3)

 

 resin dicing blade

 

   resin dicing blade


Features: High processing quality for cutting of hard, brittle materiais; Able to precisely control diamond concentration to achieve cutting quality; Improved cut quality on hard materials 

 

 

 

 

 

 

Hubless dicing blade

Application: Glass, Crystal, Quart, LiTaO3, Ceramics, Optical, QFN, splitter 

 

  metal dicing blade

   metal dicing balde

Features: High rigidityminimized wavy and slant cuttig ; Able to control diamond concentration to achieve cutting quality ;Excellent rigidit and cut quality

Application:  Electronic parts, Optical devices, semiconductor packages, BGA, CSP

 electroformed dicing blade

Electroformed dicing 

balde

Features: Wide selection of blade options; Proprietary thin-blade technology ;Blade thickness - 0.015 mm to 0.3 mm; Available for both dicing saws and slicers

Application:  Various types of semiconductor packages, ceramics, magnetic materials, PCB, silicon 

Other specification can be produced according to customer’s requirements     

diamond dicing blade

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