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International Department

More Super Hard Products Co., Ltd

TEL: 0086-371-86545906

Whatsapp: + 86 13323855288

Email: sales@moresuperhard.com

Add: no.171 zhongyuan rd, zhongyuan district, zhengzhou, henan,450001 china

Optical & Semicon Industry

Diamond Dicing Blades

Diamond Dicing Blades

Diamond dicing blade is used for grooving ,cutting silicon, compound semiconductors, glass and other materials in electronic information industry.

Type: resin dicing blade, metal dicing blade , ele
Application: Silicon wafers, compound semiconducto
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Diamond dicing blade is used for grooving ,cutting silicon, compound semiconductors, glass and other materials in electronic information industry.

The Types including diamond hub dicing blade and diamond hubless dicing blade

hub dicing blade

electroformed dicing blade

Features: Easy to handle ultra-thin blade, Blade dicing after laser grooving, Shows stable processing performance in high load processing 

Application: Silicon wafers, compound semiconductor wafers (GaAs, Gap),oxide wafers (LiTaO3)

hub dicing blade

resin bond dicing blade

resin dicing blade

Features: High quality for cutting of hard brittle materiais, Able to precisely control diamond concentration to achieve cutting quality

Application: Glass, Crystal, Quartz, LiTaO3, Ceramics, Optical, QFN, splitter

Hubless dicing blade

metal bond dicing blade

metal dicing blade

Features: minimized wavy and slant cuttig, Able to control diamond concentration to achieve cutting quality, Excellent rigidit and cut quality

Application:Electronic parts, Optical devices, semiconductor packages, BGA, CSP

electroformed hubless dicing blade

electroformed dicing blade

Features: Proprietary thin-blade technology, Blade thickness from 0.015 mm to 0.3 mm, Available for both dicing saws and slicers

Application:Various types of semiconductor packages, ceramics, magnetic materials, PCB, silicon

* other specifications can be made according to customers requirements. Email: sales@moresuperhard.com

diamond dicing blade

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